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  • Beyond 3D. Manufacturing process development requirements for multi material wafer level packaging. Presentation made at IMAPS Munich, October 2008 - Download PDF
  • Beyond 3D. Manufacturing process development requirements for multi material wafer scale packaging. Paper presented at IMAPS Munich, October 2008 - Download PDF
  • Loadpoint and Ferro-Electric Materials Processing Technical Paper - Download PDF
  • Conference Presentation - Download PDF
  • Ultra precision grinding in the fabrication of high frequency piezocomposite ultrasonic transducers - Download PDF

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